Composite Desoldering Tip SOP 16L - Hakko T16-1009

Overview

The Hakko T16-1009 is a composite desoldering tip engineered specifically for the FM 2022 parallel desoldering tweezers system. Designed in SOP 16L format, this tip enables precise and efficient removal of surface-mount integrated circuits and components from printed circuit boards without damaging surrounding traces or pads.

Key Features

• SOP 16L format optimized for 16-pin small-outline packages
• Composite construction for enhanced durability and thermal performance
• Compatible exclusively with Hakko FM 2022 parallel desoldering tweezers
• Pack of 2 replacement tips for extended operational life
• Precision-engineered geometry for reliable solder joint contact
• Manufactured in Japan to Hakko quality standards

Technical Specifications

Applications

Ideal for electronics manufacturing, PCB rework, component replacement, and precision desoldering operations in laboratory and production environments. Particularly suited for removing surface-mount ICs and passive components from densely populated circuit boards.

Scope of Delivery

• 2 × Composite desoldering tips (SOP 16L format)