Composite Desoldering Tip SOP 10L - Hakko T16-1007

Overview

The Hakko T16-1007 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 10L format, these tips enable precise and efficient removal of surface-mounted devices from PCBs without damaging surrounding components or traces.

Key Features

• SOP 10L format optimized for small outline package components
• Composite construction for enhanced durability and thermal performance
• Compatible with FM 2022 parallel desoldering tweezers
• Pack of 2 replacement tips
• Precision-engineered for SMD desoldering applications
• Reliable solder wetting and heat transfer characteristics

Technical Specifications

Applications

Ideal for rework and repair operations involving small outline package (SOP) components. Suitable for electronics manufacturing, PCB assembly, and component-level repair where precision desoldering is required.

Scope of Delivery

• 2 × Composite Desoldering Tips SOP 10L Format