PCB preheater 130 x 130 mm, 50 to 350 °C - Reeco RE-IR-860

Multilayer boards with large ground planes pull heat away from the joint. The iron or the hot air then has to work at a far higher temperature, and that is exactly what damages components and solder resist. A preheater brings the assembly up to temperature from below, so much less energy is needed from above.

The RE-IR-860 heats an area of 130 x 130 mm and controls it by microprocessor between 50 and 350 °C with a stability of ±1 °C. Measurement runs through an external K-type thermocouple placed on the assembly itself, so the displayed temperature is that of the board rather than of the hot plate.

Separate switches for mains and heating, an overheat cut-off and the steel safety mesh are part of the standard equipment.

Benefits

• Heating surface 130 x 130 mm, temperature range 50 to 350 °C
• Control accuracy of ±1 °C through microprocessor control
• Two displays for setpoint and thermocouple temperature
• Measurement taken on the assembly itself via K-type thermocouple
• Overheat protection, separate mains and heating switches, safety mesh
• Compact at 255 x 200 x 63 mm and 2.5 kg

Applications

Preheating boards before removing and fitting SMD and BGA components, repair of multilayer assemblies, work on boards with large copper areas.

Technical data