Composite Desoldering Tip SOP 8L - Hakko T8-1006

Overview

The Hakko T8-1006 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 8L format, this tip enables precise and efficient removal of surface-mount integrated circuits and other small outline package components from PCBs without damaging surrounding circuitry.

Key Features

• SOP 8L format geometry for optimal component alignment
• Composite construction for enhanced durability and thermal performance
• Compatible exclusively with FM 2022 parallel desoldering tweezers
• Enables simultaneous heating of all component leads
• Reduces thermal stress on PCB and adjacent components
• Pack of 2 tips for extended operational use

Applications

Ideal for rework and repair operations involving small outline package (SOP) integrated circuits, particularly 8-lead SOP components. Commonly used in electronics manufacturing, PCB assembly, and component-level repair where precision and minimal thermal impact are critical.