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Composite Desoldering Tip SOP 13L - Hakko T8-1008
Composite desoldering tip in SOP 13L format designed for use with Hakko FM 2022 parallel desoldering tweezers. Enables precise removal of surface-mount components. Supplied as a pack of 2 tips.
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Description
Overview
The Hakko T8-1008 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 13L format, this tip enables efficient and controlled removal of surface-mount integrated circuits and other small outline package components from PCBs without damaging surrounding circuitry.
Key Features
- SOP 13L format optimized for small outline packages
- Composite construction for enhanced durability and thermal performance
- Compatible with FM 2022 parallel desoldering tweezers
- Precision-engineered for controlled component removal
- Pack of 2 tips for extended operational use
- Reduces thermal stress on PCBs during desoldering
Applications
Ideal for rework and repair operations involving small outline package components, including SOP ICs, microcontrollers, and other miniaturized surface-mount devices. Suitable for electronics manufacturing, PCB assembly, and component-level repair work.
Technical data
| Tip Format | SOP 13L |
|---|---|
| Compatible Equipment | FM 2022 Parallel Desoldering Tweezers |
| Material | Composite |
| Quantity per Pack | 2 pieces |
| Country of Origin | Japan |
| Weight | 0.1 kg |
| Manufacturer | Hakko |
| Manufacturer Nr. | T8-1008 |
| EAN | 4962615010033 |
| HS-Code | 85159080 |
| GPSR manufacturer information | TBK - Technisches Büro Kullik GmbH Industriestrasse 27 DE-56276 Großmaischeid www.kullik.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Japan |
| Series | T18 |
Scope of delivery
- 2 × Composite desoldering tips SOP 13L format
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Datasheet
Catalogue
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