Composite Desoldering Tip SOP 13L - Hakko T8-1008

Overview

The Hakko T8-1008 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 13L format, this tip enables efficient and controlled removal of surface-mount integrated circuits and other small outline package components from PCBs without damaging surrounding circuitry.

Key Features

• SOP 13L format optimized for small outline packages
• Composite construction for enhanced durability and thermal performance
• Compatible with FM 2022 parallel desoldering tweezers
• Precision-engineered for controlled component removal
• Pack of 2 tips for extended operational use
• Reduces thermal stress on PCBs during desoldering

Technical Specifications

Applications

Ideal for rework and repair operations involving small outline package components, including SOP ICs, microcontrollers, and other miniaturized surface-mount devices. Suitable for electronics manufacturing, PCB assembly, and component-level repair work.

Scope of Delivery

• 2 × Composite desoldering tips SOP 13L format