Solder Paste Stencil BGA 225, 27 x 27 mm, for Stencil Bracket Kit - PACE 1027-0225

In BGA rework, fresh solder paste has to go onto every ball position before the part is placed again. The 1027-0225 stencil is cut for a 225-ball BGA measuring 27 x 27 mm and applies paste to the component rather than the board, which avoids the mess of stenciling on a populated PCB.

Benefits

• Aperture pattern for 225 ball positions, matched to a 27 x 27 mm package
• Paste goes onto the component, no stencil needed on the crowded PCB
• Designed for the holder of the PACE Stencil Bracket Kit 6993-0248

Specifications

Applications

• BGA rework with PACE TF rework systems
• Applying paste to BGA components before re-placement

Compatibility

• PACE Stencil Bracket Kit 6993-0248 (sold separately)