TF1800 BGA and SMD Rework System with Inductive-Convection Heater - PACE 8007-0575

For BGA, QFN, CSP, CGA, PoP, Flip Chip and 0201 work on high thermal mass boards: the TF1800 Inductive-Convection top-side heater reaches target temperature in seconds and actively cools the joint through the nozzle once de-energized, limiting intermetallic growth.

Benefits

• Stepper-driven motorized reflow head: soft component landing and 28 µm placement accuracy.
• 1000 W IR bottom-side preheater, height adjustable up to 38 mm closer to the PCB.
• Vision Overlay System with 1080p camera, up to 240x zoom and Quad-Field Imaging for large BGAs and fine-pitch QFPs.
• Counterweight balanced vacuum pick with optical sensor, 7 vacuum picks included.

Specifications

Applications

• Removal and installation of BGA, CSP, QFN and CGA
• PoP and Flip Chip rework
• Replacing 0201 parts on densely populated assemblies