IR3100 Infrared BGA Rework Station with IR Pyrometer - PACE 8007-0587

No nozzle set for every component size: the IR3100 heats BGA, QFN, µBGA/CSP and Flip Chip with 500 W of infrared from above and 1000 W from below. A specially developed IR pyrometer reads the component temperature without contact and controls both heaters in a closed loop.

Benefits

• Closed-loop control via IR pyrometer plus four thermocouple inputs, two K-type thermocouples included.
• Sodr-Cam reflow camera rotating through 180 degrees shows the exact moment of solder melt.
• 28 µm placement accuracy by stepper motor, all steps in a single axis.
• Bottom preheater can be raised up to 38 mm closer to the PCB.

Specifications

Applications

• Removal and installation of BGA, µBGA/CSP and QFN without nozzle changes
• Flip Chip rework with visual reflow verification
• Small-batch repair and lab work