Hot air nozzle square 35 x 35 mm for HCT-1000 - Oki HN-B3535

Large BGA and QFP packages need a rework nozzle that encloses the whole part without heating its neighbours. The Oki HN-B3535 is a square hot air nozzle with a 35 x 35 mm inner size for the HCT-1000 series convection tools and the modular MRS-1000A rework system.

Benefits

• Square inner size of 35 x 35 mm for components up to roughly 33 x 33 mm edge length
• Homogeneous heat input around the package, so all solder balls reflow evenly
• Confines the air flow to the target component and protects adjacent parts
• Tool-free nozzle change on the HCT-1000 hand piece
• Part of the consistent Oki nozzle programme for MRS-1000A and HCT-1000

Technical data

Applications

Removal and reflow of large BGA, CSP, QFP, LGA, PLCC and SOIC packages during repair, rework and failure analysis on populated boards.

Compatibility and scope of delivery

Compatible with the Oki HCT-1000 convection tools and the MRS-1000A rework system. Scope of delivery: one HN-B3535 hot air nozzle. Manufacturer note: the inner dimensions of the nozzles are about 2 mm larger than the stated component size, larger nozzles heat the component more evenly.