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Square hot air nozzle with 14 x 14 mm inner dimension for the MRS-1000A and HCT-1000 rework systems. Inner dimensions are 2 mm larger than the stated component size, so the package is heated evenly on all sides. Suitable for removing and replacing BGA, QFP, LGA, PLCC and SOIC devices.

Hot air nozzle square 14 x 14 mm for HCT-1000 - Oki HN-B1414

OKI Original product
Net price (excl. VAT)
€375.54
Item WL26959
Manufacturer no. HN-B1414
Personal expert advice
Brand new Specialist dealer since 2009 Original product Worldwide shipping
Product data
Manufacturer no.HN-B1414
ConditionNew
Article
WL26959

Replacing a BGA or QFP on a populated board calls for a nozzle that matches the package footprint. The HN-B1414 is a square hot air nozzle with a 14 x 14 mm inner dimension for the Oki MRS-1000A and HCT-1000 rework systems.

Benefits

  • Square 14 x 14 mm geometry for packages up to roughly 12 x 12 mm edge length
  • Inner dimension 2 mm larger than the component, giving even heating on all four sides
  • Tool-free change at the hot air head keeps changeover times short
  • Concentrates the hot air on the target device and protects neighbouring components

Technical data

Item numberWL26959
ModelHN-B1414
ManufacturerOKI
Manufacturer item numberHN-B1414
Shapesquare
Inner dimension14 x 14 mm
Weight0.1 kg

Applications

Removal and re-placement of BGA, QFP, LGA, PLCC and SOIC packages in electronics repair, prototyping and small-batch production.

Compatibility and scope of delivery

Fits the Oki MRS-1000A and HCT-1000 hot air rework systems. Scope of delivery: one HN-B1414 hot air nozzle.

More Information
Manufacturer Nr.HN-B1414
ManufacturerOki
Weight0.100000
GPSR manufacturer informationOK International Ltd Eagle Close, Chandlers Ford GB-SO53 4NF Hampshire www.metcal.com
Article authenticityOriginal product
Condition of articleNew
Position sensingNo