Desoldering gun with compressed-air vacuum for TMT-9000PS and MX units - Thermaltronics DS-GUN-1

On through-hole repair work the desoldering gun decides whether a via comes free in one go or needs several attempts. The DS-GUN-1 uses the compressed air already available at the bench, converts it into vacuum and draws the solder straight into the solder chamber while the DT series tip carries the heat into the pad.

Benefits

• Vacuum generated from standard compressed air, no separate pump needed
• Direct replacement for the Metcal MX-DS1 on existing workstations
• Runs on TMT-9000PS, MX-500, MX-5000 and MX-5200
• Filter wool and solder chamber change without tools
• Light 0.1 kg handpiece for longer repair runs

Technical data

Applications

Desoldering of leaded components, connectors and pin headers in repair, prototyping and field service. Suited to multilayer boards where heat has to reach the barrel quickly and the solder must be removed completely.

Compatibility and scope of delivery

Fits the TMT-9000PS, MX-500, MX-5000 and MX-5200 power units. The DS-HPC-1 handpiece cable provides the connection and the SHH-3 stand holds the gun during work. Supplied as a single gun without cable or stand.