ESD ball stage 150 mm with ESD cover, 360 degree rotation, 30 degree tilt - Leica 33000600

Electronic assemblies must not rest on an insulating surface at any point of the inspection bench. This ball stage combines both, a freely adjustable position across 360 degrees of rotation and about 30 degrees of tilt, with a cover made of ESD material that ties the support into the EPA.

Benefits in use

• Cover of stable ESD material, so the board does not sit on an insulating surface even during a long inspection.
• Full 360 degree rotation, the assembly is checked all round without regripping.
• Tilt of around 30 degrees, angled solder joints, connector edges and housing flanks can be presented flat to the optics.
• Support of 150 mm diameter, so larger boards and assemblies also find a secure place.
• Overall height of around 70 mm, which leaves most of the objective working distance available for tool and hand.
• The position set stays put without being held, so both hands are free for iron and tweezers.

Technical data

Applications

Visual and final inspection of printed circuit boards inside the EPA, rework and repair on solder joints, checking of connectors and contacts, incoming inspection, laboratory and training.

Compatibility and scope of delivery

The ball stage is supplied on its own. It is placed under the microscope on the base plate or the bench surface and is not tied to a particular microscope body, what matters is the free working distance of the objective. To be effective inside an EPA the workstation has to be grounded according to the rules in force there, an earth bonding lead is not part of the delivery.

Standards and compliance

The supplier declares the ball stage as ESD safe. A measured value for the resistance to ground and a test report to IEC 61340-5-1 are not part of the supplier data, so no resistance range is stated here.