Composite Desoldering Tip SOP 16L - Hakko T8-1009

Overview

The Hakko T8-1009 is a composite desoldering tip specifically engineered for the FM 2022 parallel desoldering tweezers system. Designed in SOP 16L format, this tip enables efficient and controlled removal of surface-mount integrated circuits and other small components from PCBs without damaging surrounding circuitry.

Key Features

• SOP 16L format geometry for precise component alignment
• Composite construction for optimal thermal transfer and durability
• Compatible exclusively with FM 2022 parallel desoldering tweezers
• Enables simultaneous heating of multiple component leads
• Reduces thermal stress on PCB and adjacent components
• Pack of 2 tips for extended operational use

Technical Specifications

Applications

Ideal for rework and repair operations involving small-outline package (SOP) integrated circuits with 16 leads. Commonly used in electronics manufacturing, PCB assembly, and component-level repair where precision desoldering is required.

Scope of Delivery

• 2 × Composite Desoldering Tip SOP 16L Format