ESD bubble bag, dissipative, pink, 100 x 150 mm, without flap

During shipping and storage, electronic components face two risks at once: mechanical impact and electrostatic discharge. This bubble bag in 100 x 150 mm addresses both in one package for small parts such as individual ICs, sensors, plug-in modules or memory modules. The dissipative film with a surface resistance below 10E11 Ohm keeps the bag from charging up during filling and transport, and the 10 mm bubbles absorb shocks.

Benefits

• Dissipative: surface resistance below 10E11 Ohm, charges drain off in a controlled way instead of building up.
• Impact protection: 10 mm bubbles cushion the contents without extra void fill.
• Durable film: three layers of LDPE polyethylene, 71 µm thick.
• Visible contents: the pink transparent film shows labels and parts, and the pink colour marks the bag as ESD packaging.
• Open end: version without flap for fast filling.

Applications

The compact format suits the shipment of single components and spare parts, sample deliveries and orderly storage of small parts in the warehouse. Inside an EPA the bag serves as dissipative transport and storage packaging. The range is also available in other sizes and with a flap.