ESD bubble bag, dissipative, pink, 300 x 400 mm, without flap

During shipping and storage, electronic components face two risks at once: mechanical impact and electrostatic discharge. This bubble bag in 300 x 400 mm addresses both in one package for large printed circuit boards, assemblies and device modules. The dissipative film with a surface resistance below 10E11 Ohm keeps the bag from charging up during filling and transport, and the 10 mm bubbles absorb shocks.

Benefits

• Dissipative: surface resistance below 10E11 Ohm, charges drain off in a controlled way instead of building up.
• Impact protection: 10 mm bubbles cushion the contents without extra void fill.
• Durable film: three layers of LDPE polyethylene, 71 µm thick.
• Visible contents: the pink transparent film shows labels and parts, and the pink colour marks the bag as ESD packaging.
• Open end: version without flap for fast filling.

Applications

The large format takes large printed circuit boards, mainboards, rack modules and complete assemblies and suits shipping, repair logistics and storage of larger electronic components. Inside an EPA the bag serves as dissipative transport and storage packaging. The range is also available in other sizes and with a flap.