ESD bubble bag, dissipative, pink, 200 x 300 mm, without flap

During shipping and storage, electronic components face two risks at once: mechanical impact and electrostatic discharge. This bubble bag in 200 x 300 mm addresses both in one package for longer printed circuit boards and assemblies. The dissipative film with a surface resistance below 10E11 Ohm keeps the bag from charging up during filling and transport, and the 10 mm bubbles absorb shocks.

Benefits

• Dissipative: surface resistance below 10E11 Ohm, charges drain off in a controlled way instead of building up.
• Impact protection: 10 mm bubbles cushion the contents without extra void fill.
• Durable film: three layers of LDPE polyethylene, 71 µm thick.
• Visible contents: the pink transparent film shows labels and parts, and the pink colour marks the bag as ESD packaging.
• Open end: version without flap for fast filling.

Applications

The elongated format is intended for long printed circuit boards, plug-in cards and assemblies with connectors that move between production, repair and shipping. Inside an EPA the bag serves as dissipative transport and storage packaging. The range is also available in other sizes and with a flap.