Hot Air Nozzle BGA 15×15 - Hakko A1473

Overview

The Hakko A1473 is a precision hot air nozzle designed for BGA (Ball Grid Array) component rework. With a 15×15 mm opening, it delivers concentrated heat for soldering and desoldering fine-pitch surface-mount devices on PCBs. This nozzle is a direct replacement part for Hakko hot air rework stations.

Key Features

• BGA-optimized 15×15 mm nozzle opening
• Compatible with Hakko 850, FR-801, FR-802, and FR-803 stations
• Precision heat distribution for controlled rework
• Durable construction for repeated use
• Easy installation and replacement

Technical Specifications

Applications

Ideal for rework and repair of BGA components, fine-pitch QFP packages, and other surface-mount devices requiring localized heating. Suitable for electronics manufacturing, repair shops, and PCB assembly operations.