Hot Air Nozzle BGA 27×27mm - Hakko A1475

Overview

The Hakko A1475 is a precision hot air nozzle designed for BGA (Ball Grid Array) rework applications. With a 27×27mm opening, it delivers focused thermal energy for controlled soldering and desoldering of fine-pitch BGA packages on PCBs. Compatible with Hakko 850, FR-801, FR-802, and FR-803 hot air stations.

Key Features

• 27×27mm BGA-optimized nozzle opening
• Uniform heat distribution for consistent reflow profiles
• Compatible with multiple Hakko hot air station models
• Durable ceramic construction
• Precision-engineered for professional rework

Technical Specifications

Applications

Ideal for BGA rework, fine-pitch component soldering, and thermal profiling in electronics manufacturing and repair. Suitable for prototype development, production rework, and field service applications.