Images are examples, some edited with AI. The technical data are authoritative. AI notice
Soldering Tip 0.2D Format - Hakko T50-D02
Active soldering tip in 0.2D format designed for Hakko FX-9703 and FX-9704 soldering irons. Delivers precise heat transfer for fine-pitch component soldering and detailed electronics assembly work.
- Specialist dealer since 2009
- Invoice payment for regular customers
- Worldwide shipping
- Technical questions clarified with the manufacturer
Description
Overview
The Hakko T50-D02 is an active soldering tip featuring a 0.2D format geometry, engineered for use with Hakko FX-9703 and FX-9704 soldering irons. This precision tip delivers concentrated heat delivery for fine soldering applications requiring excellent thermal contact and minimal thermal mass.
Key Features
- 0.2D format tip geometry for precision soldering
- Active tip design with optimized heat transfer characteristics
- Compatible with FX-9703 and FX-9704 soldering irons
- Suitable for fine-pitch and detailed electronics work
- Durable construction for extended operational life
Applications
Ideal for fine-pitch soldering, surface-mount device (SMD) assembly, precision electronics repair, and detailed circuit board work where concentrated heat and minimal thermal mass are essential.
Technical data
| Tip Format | 0.2D |
|---|---|
| Compatible Irons | FX-9703, FX-9704 |
| Country of Origin | Japan |
| Weight | 0.02 kg |
| Manufacturer | Hakko |
| Manufacturer Nr. | T50-D02 |
| EAN | 4962615059520 |
| HS-Code | 85159080 |
| GPSR manufacturer information | TBK - Technisches Büro Kullik GmbH Industriestrasse 27 DE-56276 Großmaischeid www.kullik.com |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | Japan |
| Soldering tip shape | meißelförmig |
| Series | T50 |
Downloads
Datasheet
Catalogue
Questions about this item
Any other question?
Send us the item number and your question. We clarify technical details directly with the manufacturer and usually reply on the next working day.
