LQFP/TQFP Removal Tip 28 x 28 mm, 2.0 mm Footprint, for TP-100 ThermoPik - PACE 1124-2005

Large, low-profile LQFP and TQFP packages with 208 or 256 leads only come off cleanly when all four sides reflow at once. This ThermoPik tip surrounds a 28 x 28 mm body with 1.4 mm height and melts the solder on every lead at the same time.

Benefits

• All four lead rows heat at once, so the part releases without levering force on the pads
• 28 x 28 mm inner size matched to the package, heat goes into the joints instead of the surroundings
• Matched to a 1.4 mm body height so the heated face rests on the leads

Specifications

Applications

• Replacing faulty processors and FPGAs in LQFP-208/256 packages
• Rework on densely populated control boards with large flat packs
• Component recovery for failure analysis

Compatibility

• PACE TP-100 ThermoPik Handpiece IntelliHeat (6010-0158)