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ThermoBond Cir-Kit Frame DIP Pad for Through-Hole Lands - PACE 1200-0163-01

Name: ThermoBond Cir-Kit Frame DIP Pad for Through-Hole Lands - PACE 1200-0163-01
Brand: PACE
SKU: PC-1200-0163-01
Price: 37.22 EUR
Availability: InStock

PACE ✓ Original product Brand new Made in United States

ThermoBond frame with DIP lands from the PACE thru-hole Cir-Kit. For replacing damaged pads on DIP components and sockets.

Net

€37.22

excl. VAT

Item PC-1200-0163-01

Manufacturer no. 1200-0163-01

Question about this item

Datasheet (PDF) 2 documents, all under Downloads

Specialist dealer since 2009
Invoice payment for regular customers
Worldwide shipping
Technical questions clarified with the manufacturer

Description

Replacing DIP devices or sockets can easily lift the lands around the holes. The DIP Pad frame provides matching replacement lands, solder plated on one side.

Benefits

Land shape for DIP components
Solder plated on one side for the solder joint
Part of the ThermoBond Cir-Kit, Thru-Hole Version 6993-0179

Specifications

Applications

Replacing lifted lands on DIP footprints
Repair after socket or IC replacement

Technical data

Part number	1200-0163-01
Type	ThermoBond Cir-Kit frame
Version	DIP Pad
Finish	Solder plated on one side
Sales unit	1 piece
Weight	0.05 kg
Manufacturer	PACE
Manufacturer Nr.	1200-0163-01
HS-Code	85159080
GPSR manufacturer information	A1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment
Condition of article	New
Article authenticity	Original product
Country of Manufacture	United States