Foto folgt: ThermoBond Cir-Kit Rahmen für SOIC und TSOP, einseitig verzinnt

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ThermoBond Cir-Kit Frame for SOICs and TSOPs, Solder Plated One Side - PACE 1200-0150-01

Name: ThermoBond Cir-Kit Frame for SOICs and TSOPs, Solder Plated One Side - PACE 1200-0150-01
Brand: PACE
SKU: PC-1200-0150-01
Price: 37.22 EUR
Availability: InStock

PACE ✓ Original product Brand new Made in United States

ThermoBond frame with replacement pads for SOIC and TSOP packages from the PACE surface mount Cir-Kit. Used to rebuild lifted pads on fine-pitch footprints.

Net

€37.22

excl. VAT

Item PC-1200-0150-01

Manufacturer no. 1200-0150-01

Question about this item

Datasheet (PDF) 2 documents, all under Downloads

Specialist dealer since 2009
Invoice payment for regular customers
Worldwide shipping
Technical questions clarified with the manufacturer

Description

If individual pads lift while removing an SOIC or TSOP, the footprint is rebuilt with preformed replacement pads. This ThermoBond frame, solder plated on one side, carries the pad shapes for these packages.

Benefits

Pad shapes matching SOIC and TSOP footprints
Solder plated on one side, ready to solder
Part of the ThermoBond Cir-Kit, Surface Mount Version 6993-0176

Specifications

Applications

Pad repair on SOIC and TSOP footprints
Rework after component replacement

Technical data

Part number	1200-0150-01
Type	ThermoBond Cir-Kit frame
Package	SOIC, TSOP
Finish	Solder plated on one side
Sales unit	1 piece
Weight	0.05 kg
Manufacturer	PACE
Manufacturer Nr.	1200-0150-01
HS-Code	85159080
GPSR manufacturer information	A1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment
Condition of article	New
Article authenticity	Original product
Country of Manufacture	United States