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Funnelet for PCB Pad and Hole Repair - PACE 1347-0001
Funnel-shaped eyelet (funnelet) from PACE for restoring lifted pads at through-hole locations. The funnelet forms a new contact surface to which the component is soldered again.
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- Invoice payment for regular customers
- Worldwide shipping
- Technical questions clarified with the manufacturer
Description
When a pad lifts off together with its copper during component removal, the solder joint has nothing to bond to. A funnelet is set into the hole and its flange replaces the missing contact surface.
Benefits
- New solder surface without replacing the circuit board
- Funnel shape makes it easier to solder the component lead
Specifications
Applications
- Replacing lifted pads at through-hole locations
- Rework after removing leaded components
Technical data
| Manufacturer part number | 1347-0001 |
|---|---|
| Type | Funnelet, funnel-shaped eyelet |
| Dimensions | not specified, select by part number |
| Sales unit | 1 piece |
| Weight | 0.05 kg |
| Manufacturer | PACE |
| Manufacturer Nr. | 1347-0001 |
| HS-Code | 85159080 |
| GPSR manufacturer information | A1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | United States |
Downloads
Datasheet
Catalogue
Accessories
Eyelet for Plated Through-Hole Replacement, Cir-Kit Accessory - PACE 1347-0013
Item PC-1347-0013Questions about this item
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