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ThermoBond Cir-Kit, Surface Mount Version - PACE 6993-0176
Surface mount version of the ThermoBond Cir-Kit for repairing damaged SMD pads and traces. The replacement pads are solder plated on one side and grouped by package type from chip components to PQFP.
- Specialist dealer since 2009
- Invoice payment for regular customers
- Worldwide shipping
- Technical questions clarified with the manufacturer
Description
A lifted pad under a QFP or SOIC can be restored using the ThermoBond method: the replacement pad, solder plated on one side, is bonded with a ThermoBond tip. The surface mount kit provides frames for the main SMD packages plus tools for cutting, scraping and masking.
Benefits
- Frames by package type: chip R/C, inductors and MELFs, SOTs, SOICs/TSOPs, PLCCs/LCCCs/SOJs/ceramic QFPs, PQFPs
- ThermoBond frames solder plated on one side for heat bonding
- Dry film adhesive for custom shaping and cutting
- Provise kit for cutting and scraping, Kapton tape for masking
Specifications
Applications
- Replacing lifted SMD pads under fine-pitch components
- Repair in electronics workshops and rework
Technical data
| Manufacturer part number | 6993-0176 |
|---|---|
| Type | ThermoBond Cir-Kit, Surface Mount Version |
| Frames | 1200-0147-01, -0148-01, -0149-01, -0150-01, -0151-01, -0152-01 |
| Accessories | Abrasive Stick 1129-0014, Kapton tape 12.7 x 76.2 mm (10 pieces), Provise Kit 7016-0003 |
| Required | ThermoBond tips (separate per catalog) |
| Sales unit | 1 piece (kit) |
| Weight | 0.05 kg |
| Manufacturer | PACE |
| Manufacturer Nr. | 6993-0176 |
| HS-Code | 85159080 |
| GPSR manufacturer information | A1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment |
| Condition of article | New |
| Article authenticity | Original product |
| Country of Manufacture | United States |
Downloads
Datasheet
Catalogue
Accessories
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