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ThermoBond Cir-Kit, Surface Mount Version - PACE 6993-0176

PACE ✓ Original product Brand new Made in United States

Surface mount version of the ThermoBond Cir-Kit for repairing damaged SMD pads and traces. The replacement pads are solder plated on one side and grouped by package type from chip components to PQFP.

Net
€653.15
excl. VAT
Item PC-6993-0176
Manufacturer no. 6993-0176
Question about this item
  • Specialist dealer since 2009
  • Invoice payment for regular customers
  • Worldwide shipping
  • Technical questions clarified with the manufacturer

Description

A lifted pad under a QFP or SOIC can be restored using the ThermoBond method: the replacement pad, solder plated on one side, is bonded with a ThermoBond tip. The surface mount kit provides frames for the main SMD packages plus tools for cutting, scraping and masking.

Benefits

  • Frames by package type: chip R/C, inductors and MELFs, SOTs, SOICs/TSOPs, PLCCs/LCCCs/SOJs/ceramic QFPs, PQFPs
  • ThermoBond frames solder plated on one side for heat bonding
  • Dry film adhesive for custom shaping and cutting
  • Provise kit for cutting and scraping, Kapton tape for masking

Specifications

Applications

  • Replacing lifted SMD pads under fine-pitch components
  • Repair in electronics workshops and rework

Technical data

Manufacturer part number6993-0176
TypeThermoBond Cir-Kit, Surface Mount Version
Frames1200-0147-01, -0148-01, -0149-01, -0150-01, -0151-01, -0152-01
AccessoriesAbrasive Stick 1129-0014, Kapton tape 12.7 x 76.2 mm (10 pieces), Provise Kit 7016-0003
RequiredThermoBond tips (separate per catalog)
Sales unit1 piece (kit)
Weight0.05 kg
ManufacturerPACE
Manufacturer Nr.6993-0176
HS-Code85159080
GPSR manufacturer informationA1-ESD equipment GmbH. Keldersstr. 15, DE-42697 Solingen, www.esd.equipment
Condition of articleNew
Article authenticityOriginal product
Country of ManufactureUnited States

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