ST 400 Radiant/IR PCB Preheater, 37 to 205 °C - PACE 8007-0436

Preheating is required when installing area array components and large leaded devices. The ST 400 warms the PCB from below with radiant heat in the range of 37 to 205 °C, with 3 °C stability at idle.

Benefits

• Keeps the PCB from twisting or warping during rework.
• Maintains the planarity of the rework site for clean BGA placement.
• The board draws less heat away from the top heater.
• Absolute temperature stability meets or exceeds ANSI-J-STD.

Specifications

Applications

• BGA and area array rework together with hot air stations such as the ST 325
• Installing and removing large leaded components