Re-balling reflow oven 1600W, 50-300°C, sensor-controlled - Quick 3000

The Quick 3000 is a sensor-controlled infrared reflow oven for BGA re-balling processes. With 1600W total power and a closed temperature control loop it reaches precise, stable temperatures with low fluctuation.

Benefits

• Uniform whole-board heating minimises temperature differences between components
• Up to 10 freely selectable temperature profiles can be stored
• Viewing window for real-time control of BGA solder ball melting
• Process-abort alarm and automatic cooling cycle after a profile ends
• 2 external type K thermocouples can be connected for monitoring or control

Technical data

• Total power: 1600W (bottom IR ceramic plate 400W, top IR quartz emitter 1200W)
• Temperature range: 50°C - 300°C
• Storable temperature profiles: 10
• Usable heating area: 130 x 130 mm
• Housing dimensions: 355 x 225 x 180 mm

Applications

• BGA re-balling and reflow processes in repair and small-batch work

Compliance: CE, RoHS. Origin: China.