Desoldering nozzle for pins up to 1.1 mm, inner D 1.3 mm - JBC C560-009

The C560-009 desoldering nozzle removes solder from plated-through holes with pins up to 1.1 mm diameter. The 1.3 mm inner diameter takes the pin cleanly while the nozzle melts and extracts the solder all around it. The C560 series provides instant heating and excellent heat transfer.

Benefits

• For pins up to 1.1 mm, 1.3 mm inner diameter for clean pick-up
• Instant heating and excellent heat transfer of the C560 series
• Even melting of the solder all around the pin
• 5 mm outer diameter for good access to the joint
• Tool-free change on the DR560 desoldering handpiece

Technical data

Applications

For desoldering THT components and connectors with pins up to 1.1 mm in repair and rework.

Compatibility and scope of supply

Fits the DR560 desoldering handpiece. Supplied as a single piece. The C560 series covers further pin diameters with additional nozzles.

ESD-safe, CE, RoHS, for workplaces per IEC 61340-5-1. Made in Spain.