Did you know? 217 °C

SAC305 is 96.5 percent tin, 3 percent silver and 0.5 percent copper. It melts around 217 degrees Celsius, some 34 degrees above the old eutectic tin lead alloy.

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Desoldering tips C560

Desoldering tips

JBC C560 desoldering tips are designed exclusively for the DR560-A desoldering iron and cover bore diameters from 0.4 mm to 2.8 mm. The range is split into two groups: pin desoldering tips (C560001-C560009, C560014-C560018) and pad-cleaning tips (C560011-C560013) for removing residual solder after component extraction. The hollow-needle geometry channels molten solder directly into the DR560-A integrated vacuum system, leaving the pad clean for re-population.

⚙ Bore range 0.4-2.8 mm - C560001 (0.4 mm) to C560015 (2.8 mm), selectable by pin diameter from BOM

✓ Pad-cleaning tips C560011-C560013 - 0.6 mm / 0.8 mm / 1.0 mm bore, removes solder residue directly on the pad

🛠 DR560-A compatibility - form-fit mounting, no additional tooling required for tip change

⚡ Rapid heat transfer - JBC T245 heating cartridge in the DR560-A ensures short heat-up time and stable working temperature

Model	Type	Bore (max.)
C560001	Pin desoldering tip	0.4 mm
C560002	Pin desoldering tip	0.6 mm
C560003	Pin desoldering tip	0.8 mm
C560004 / C560009	Pin desoldering tip	1.1 mm
C560005	Pin desoldering tip	1.3 mm
C560006	Pin desoldering tip	1.7 mm
C560007 / C560018	Pin desoldering tip	2.2 mm
C560015	Pin desoldering tip	2.8 mm
C560011	Pad cleaning	0.6 mm
C560012	Pad cleaning	0.8 mm
C560013	Pad cleaning	1.0 mm

Typical applications: Rework and repair of through-hole components (THT) on double-sided and multilayer PCBs, desoldering connectors and relays with pin pitches per IPC-7711/7721, pad cleaning prior to component re-population, and removal of transformers and inductors with large pin cross-sections up to 2.8 mm.

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What are JBC C560 desoldering tips and their primary industrial applications?

JBC C560 desoldering tips are precision thermal removal tools specifically engineered for the DR560-A desoldering iron system used in electronics manufacturing and PCB rework operations. These tips operate through controlled vacuum suction combined with localized heating to extract solder from through-hole components, surface mount devices, and PCB pad cleaning applications. Primary industries utilizing C560 tips include automotive electronics manufacturing, aerospace PCB assembly, medical device production, and telecommunications equipment repair where component-level rework requires precise solder removal without thermal damage to adjacent components.

How do I select the correct C560 tip diameter for specific desoldering applications?

C560 tip selection depends on target component pin diameter and application type, with available sizes ranging from 0.4mm (C560001) for fine-pitch components up to 2.8mm (C560015) for larger through-hole pins. For standard IC pins and resistors, the C560003 (0.8mm) and C560004 (1.1mm) tips provide optimal solder extraction efficiency. Pad cleaning applications require specialized tips like C560011 (0.6mm), C560012 (0.8mm), and C560013 (1.0mm) which feature modified geometries for surface cleaning rather than pin extraction. The tip inner diameter should match the component pin diameter within plus or minus 0.1mm tolerance for maximum vacuum efficiency and thermal transfer.

What international standards apply to JBC C560 desoldering tip manufacturing and performance?

JBC C560 desoldering tips comply with IEC 61191-1 standards for electronic assembly equipment and ISO 9001 quality management requirements for precision manufacturing processes. The tips meet IPC-7711 rework standards for component removal procedures and thermal profiles in electronics assembly operations. Material composition follows RoHS compliance directives for lead-free manufacturing environments, while thermal performance characteristics align with IEC 60068-2-2 temperature testing protocols. ESD protection requirements conform to IEC 61340-5-1 standards for electrostatic discharge control in sensitive electronic component handling applications.

What are the key differences between C560 pin extraction tips versus pad cleaning variants?

C560 pin extraction tips (models C560001 through C560018) feature cylindrical hollow designs with precise internal diameters from 0.4mm to 2.8mm optimized for component pin removal through vacuum suction and thermal heating. Pad cleaning variants (C560011, C560012, C560013) incorporate modified tip geometries with 0.6mm, 0.8mm, and 1.0mm openings respectively, designed for surface solder residue removal rather than through-hole pin extraction. Pin extraction tips maintain constant internal diameter for consistent vacuum flow, while pad cleaning tips feature chamfered or angled surfaces that facilitate lateral movement across PCB surfaces without component pin engagement.

What are the installation requirements and system compatibility for C560 desoldering tips?

JBC C560 desoldering tips require exclusive compatibility with the DR560-A desoldering iron system and cannot be interchanged with other JBC desoldering platforms due to proprietary thermal sensor integration and mechanical coupling specifications. Installation involves thermal shutdown of the DR560-A system, removal of the existing tip using the provided extraction tool, and insertion of the replacement C560 tip until the mechanical lock engages with an audible click confirmation. The system automatically recognizes tip thermal characteristics through integrated temperature sensor feedback and adjusts heating parameters accordingly. Proper installation requires verification of vacuum seal integrity through initial suction testing before operational use.

What are the operating temperature ranges and safety specifications for C560 desoldering tips?

JBC C560 desoldering tips operate within a controlled temperature range of 200°C to 450°C with plus or minus 1°C accuracy through integrated thermal sensor feedback in the DR560-A system. The tips maintain thermal stability during continuous operation with response times under 2 seconds for temperature adjustments and recovery. Safety features include automatic sleep mode activation after 10 minutes of inactivity and thermal protection circuits that prevent overheating damage to temperature-sensitive components. Operating environment specifications accommodate ambient temperatures from 10°C to 40°C with relative humidity up to 80% non-condensing, ensuring reliable performance in standard electronics manufacturing environments.

What maintenance schedule and service life should be expected for C560 desoldering tips?

JBC C560 desoldering tips typically achieve 200-400 hours of operational service life depending on usage intensity and solder composition exposure, with lead-free soldering applications generally extending tip longevity compared to leaded solder processes. Daily maintenance requires tip cleaning with approved flux removers and verification of vacuum suction performance through standardized flow testing procedures. Weekly inspection protocols include visual assessment of tip wear patterns, measurement of internal diameter changes exceeding plus or minus 0.05mm tolerance, and thermal response verification within manufacturer specifications. Tip replacement becomes necessary when vacuum efficiency drops below 80% of original performance or when internal diameter erosion compromises component pin fit tolerances during desoldering operations.

Desoldering tips C560

Technical features of the C560 series

C560 model overview by bore diameter

Typical applications