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Desoldering nozzle round 2.5 mm for HCT-900 - Oki H-D25
When removing through-hole parts the nozzle has to fit closely around the lead, otherwise the vacuum draws air instead of solder. The round H-D25 desoldering nozzle has a 2.5 mm inner diameter and is intended for the HCT-900 desoldering station. It covers common THT pins and medium solder volumes.
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Description
Whether a plated through hole comes clear cleanly depends mainly on nozzle diameter: it has to match the lead so the vacuum really empties the hole. The Oki H-D25 is a round desoldering nozzle of 2.5 mm for the HCT-900 desoldering station.
Benefits
- 2.5 mm inner diameter for common THT leads and medium solder volumes
- Round geometry for even heat transfer all around the pin
- Genuine Oki nozzle, exact fit on the HCT-900 handpiece
- Wear part that can be replaced on its own instead of the whole handpiece
Applications
Removal of THT components, connectors and multi-pin parts and clearing of plated through holes in repair, test and electronics manufacturing.
Compatibility and scope of delivery
For the Oki HCT-900 desoldering station and its desoldering handpiece. Scope of delivery: one H-D25 desoldering nozzle.
Technical data
| Item number | WL26055 |
|---|---|
| Model | H-D25 |
| Manufacturer | OKI |
| Manufacturer item number | H-D25 |
| Diameter | 2.5 mm |
| Shape | round |
| Use | for HCT-900 |
| Weight | 0.1 kg |
| Weight | 0.100000 |
| Manufacturer Nr. | H-D25 |
| GPSR manufacturer information | OK International Ltd Eagle Close, Chandlers Ford GB-SO53 4NF Hampshire www.metcal.com |
| Condition of article | New |
| Article authenticity | Original product |
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