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Hot air desoldering nozzle QFP-44 13.4 x 13.4 mm for HCT-900 - Oki H-Q10
Fine-pitch QFP packages do not tolerate uneven heating. The H-Q10 nozzle with a 13.4 x 13.4 mm inner contour takes QFP-44 devices and guides hot air onto every lead row. It is made for the Oki HCT-900 rework system.
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Description
When a QFP-44 is removed, all four lead rows have to reach soldering temperature at the same time or the lead frame distorts. The H-Q10 is the Oki HCT-900 desoldering nozzle for this package and works with a 13.4 x 13.4 mm inner contour.
Benefits
- 13.4 x 13.4 mm inner dimension for QFP-44 packages
- Circumferential air flow reaches all lead rows simultaneously
- Confined heat input protects neighbouring SMD parts
- Fast nozzle change on the HCT-900 handpiece
- Genuine Oki accessory, dimensionally accurate for repeatable rework
Applications
SMD rework on assembled boards, replacement of faulty QFP-44 devices, failure analysis and small batch repair.
Compatibility and scope of delivery
Intended for the Oki HCT-900 hot air rework system. Scope of delivery: one H-Q10 desoldering nozzle.
Technical data
| Item number | WL30760 |
|---|---|
| Model | H-Q10 |
| Manufacturer | OKI |
| Manufacturer item number | H-Q10 |
| Package | QFP-44 |
| Inner dimension D | 13.4 x 13.4 mm |
| Weight | 0.1 kg |
| Manufacturer Nr. | H-Q10 |
| GPSR manufacturer information | OK International Ltd Eagle Close, Chandlers Ford GB-SO53 4NF Hampshire www.metcal.com |
| Condition of article | New |
| Article authenticity | Original product |
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