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Desoldering nozzle 6.8 x 10.2 mm for SOIC 14 and 16 - Oki H-S16
Desoldering nozzle with 6.8 x 10.2 mm inner size for SOIC packages with 14 and 16 pins on the HCT-900 hot air system. The nozzle surrounds the device and heats all leads at once so it lifts off without stressing the pads. Tool-free change at the hot air head.
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Description
SOIC packages come off cleanly only when both rows of leads reach temperature together. The H-S16 is a desoldering nozzle with a 6.8 x 10.2 mm inner size, matched to SOIC 14 and SOIC 16 on the HCT-900.
Benefits
- Inner size 6.8 x 10.2 mm, a close fit for SOIC packages with 14 and 16 leads
- Enclosing shape heats both lead rows simultaneously and shortens dwell time
- Focused hot air stream protects neighbouring components on the board
- Changed at the hot air head without tools, keeping changeover times short
Applications
Removal and replacement of SOIC 14 and SOIC 16 devices in electronics repair, rework and prototyping.
Compatibility and scope of delivery
Fits the Oki HCT-900 hot air desoldering system. Scope of delivery: one H-S16 desoldering nozzle.
Technical data
| Item number | WL27140 |
|---|---|
| Model | H-S16 |
| Manufacturer | OKI |
| Manufacturer item number | H-S16 |
| Inner dimension | 6.8 x 10.2 mm |
| Component | SOIC 14, SOIC 16 |
| System | HCT-900 |
| Weight | 0.1 kg |
| Manufacturer Nr. | H-S16 |
| GPSR manufacturer information | OK International Ltd Eagle Close, Chandlers Ford GB-SO53 4NF Hampshire www.metcal.com |
| Condition of article | New |
| Article authenticity | Original product |
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