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Vacuum cup 11 mm for HCT-1000 pack of 5 - Oki HCTA-VC11-5
When a reflowed device is lifted, the vacuum cup decides whether the package comes off the board cleanly. The HCTA-VC11-5 has an 11 mm diameter and takes larger QFP and BGA packages securely. The pack of 5 covers normal wear at the rework bench.
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Description
Once the joints are molten the device has to be lifted straight up, otherwise solder smears across the pads. The HCTA-VC11-5 vacuum cup with 11 mm diameter fits the vacuum pick of the Oki HCT-1000 and picks up large packages flat.
Benefits
- 11 mm cup diameter for large QFP, PLCC and BGA packages
- Flat lift without lateral offset protects pads and solder mask
- Elastic lip compensates minor unevenness of the package surface
- Wear part that is changed without tools
- Pack of 5 as a stock item for the repair bench
Applications
Picking and placing SMD devices in rework, removal of large packages, populating repair assemblies and prototypes.
Compatibility and scope of delivery
Intended for the Oki HCT-1000 rework system. Scope of delivery: 5 vacuum cups of 11 mm diameter.
Technical data
| Item number | WL30990 |
|---|---|
| Model | HCTA-VC11-5 |
| Manufacturer | OKI |
| Manufacturer item number | HCTA-VC11-5 |
| Diameter D | 11 mm |
| Pack unit | 5 pcs |
| Weight | 0.1 kg |
| Manufacturer Nr. | HCTA-VC11-5 |
| GPSR manufacturer information | OK International Ltd Eagle Close, Chandlers Ford GB-SO53 4NF Hampshire www.metcal.com |
| Condition of article | New |
| Article authenticity | Original product |
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