Desoldering nozzle round 5.0 mm for HCT-900 - Oki H-D50

Round desoldering nozzle for the Oki HCT-900 desoldering system. Its 5.0 mm diameter encloses large pads and heavy leads so the molten solder is pulled out of the plated-through hole completely by the vacuum flow.

Benefits

• Inner diameter 5.0 mm for large pads and heavy component leads
• Round shape transfers heat evenly around the whole pad edge
• Changed directly on the handpiece without reconfiguring the station
• Original Oki nozzle with a positive seal to the vacuum channel
• Reduces rework by removing residual solder in one pass

Applications

Desoldering of connectors, electrolytic capacitors, power semiconductors and other leaded parts with large pads in repair, rework and board overhaul.

Compatibility and scope of delivery

Fits the Oki HCT-900 desoldering system and its desoldering handpiece. Scope of delivery: 1 desoldering nozzle H-D50.