Dip- und Printstation - Ersa 0PR100

In rework it is the deposit on the terminations that decides whether a joint holds after reflow. Flux brushed on by hand or paste spread with a spatula varies from component to component. The Ersa dip and print station makes that step repeatable and covers the usual component range from BGA to QFN with two processes in one unit.

What the station does

• Dip process with optional dip stencils, the component enters flux or solder paste to a defined depth and receives an even deposit on every termination.
• Print process with a component specific print stencil, the clamped component is printed with solder paste from below, suited to QFN and MLF terminations and further SMD packages.
• Direct handover into the process, after printing the placement unit lifts the component out of the stencil and sets it down without an intermediate tray.
• Component range from BGA through most fine pitch packages to QFN and MLF, so one station covers the everyday repair workload.
• A matching frame fixture holding the stencil frame on the placement system exists for every Ersa rework system, so the station survives a change of machine.

Technical data

Application, scope of delivery and compatibility

The station belongs on every rework bench where BGAs and QFNs are exchanged regularly and the deposit volume has to be repeatable on record. Delivery covers the dip and print station, dip and print stencils are component specific and optional, as is the frame fixture of the respective rework system.