Hot Air Nozzle BGA 10×10mm - Hakko N51-13

Overview

The Hakko N51-13 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) rework applications. With a 10×10mm opening, this nozzle delivers concentrated, uniform heat distribution ideal for fine-pitch component soldering and desoldering on the FR-810 and FR-810B hot air stations.

Key Features

• 10×10mm nozzle opening optimized for BGA packages
• Compatible with Hakko FR-810 and FR-810B hot air rework stations
• Precision-engineered for uniform heat distribution
• Enables controlled thermal profiling for sensitive components
• Durable construction for extended rework sessions

Technical Specifications

Applications

Ideal for rework and repair of fine-pitch BGA components in electronics manufacturing, PCB assembly, and field service environments. Provides precise thermal control for lead-free and traditional solder alloys.