Hot Air Nozzle BGA 15×15mm - Hakko N51-16

Overview

The Hakko N51-16 is a precision hot air nozzle engineered for BGA (Ball Grid Array) rework applications. With a 15×15mm opening, this nozzle delivers concentrated, uniform heat distribution ideal for reflowing solder on fine-pitch surface-mount components. It is the standard nozzle for the FR-810 and FR-810B hot air rework stations.

Key Features

• 15×15mm square opening optimized for BGA component heating
• Compatible with Hakko FR-810 and FR-810B hot air stations
• Precision-engineered for uniform thermal distribution
• Durable ceramic construction for extended service life
• Easy installation and removal for quick nozzle changes
• Supports controlled reflow and desoldering operations

Technical Specifications

Applications

Ideal for reworking BGA, QFP, and other fine-pitch surface-mount components. Provides precise thermal control for solder reflow, component removal, and replacement in electronics manufacturing and repair environments.

Scope of Delivery

• 1× Hakko N51-16 Hot Air Nozzle (15×15mm)