Hot Air Nozzle BGA 40×40mm - Hakko N51-26

Overview

The Hakko N51-26 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) rework applications. With a 40×40mm opening, it delivers uniform thermal distribution across large component areas, making it ideal for professional electronics repair and manufacturing environments.

Key Features

• 40×40mm square opening optimized for BGA component heating
• Compatible with Hakko FR-810 and FR-810B hot air stations
• Precision-engineered for uniform air distribution
• ESD-safe construction for sensitive component protection
• Durable ceramic heating element design
• Easy installation and replacement

Technical Specifications

Applications

Ideal for BGA rework, microcontroller replacement, memory chip soldering, and other large-area component heating tasks in electronics manufacturing, repair shops, and research laboratories.

Scope of Delivery

• 1× Hakko N51-26 Hot Air Nozzle