Hot Air Nozzle BGA 27×27mm - Hakko N51-22

Overview

The Hakko N51-22 is a specialized hot air nozzle engineered for BGA (Ball Grid Array) rework applications. With a 27×27mm opening, it delivers concentrated, uniform heat distribution ideal for medium-sized BGA packages and similar surface-mount components requiring precise thermal control.

Key Features

• 27×27mm square opening optimized for BGA rework
• Uniform heat distribution for consistent solder reflow
• Compatible with FR-810 and FR-810B hot air stations
• Durable construction for extended professional use
• Precision-engineered for reliable component placement and removal

Technical Specifications

Applications

Ideal for rework and repair of BGA components in electronics manufacturing, PCB assembly, and component-level repair. Suitable for medium-sized ball grid array packages and similar surface-mount devices requiring controlled thermal profiles.

Scope of Delivery

• 1× Hakko N51-22 Hot Air Nozzle (27×27mm)