Hot Air Nozzle BGA 14×14mm - Hakko N51-15

Overview

The Hakko N51-15 is a precision hot air nozzle engineered for ball grid array (BGA) component rework applications. With a 14×14mm opening, this nozzle delivers focused thermal energy for controlled soldering and desoldering of BGA packages on PCBs. It is specifically designed for use with the Hakko FR-810 and FR-810B hot air rework stations.

Key Features

• 14×14mm nozzle opening optimized for BGA packages
• Direct compatibility with FR-810 and FR-810B hot air stations
• Precision-engineered for uniform heat distribution
• Durable construction for extended rework sessions
• Enables controlled thermal profiling for sensitive components

Technical Specifications

Applications

Ideal for professional rework of BGA components in electronics manufacturing, repair, and prototyping environments. Suitable for lead-free and lead-based solder applications with proper temperature control via the host station.