Hot Air Nozzle BGA 22×22mm - Hakko N51-20

Overview

The Hakko N51-20 is a precision hot air nozzle designed specifically for BGA (ball grid array) component rework. With a 22×22mm opening, this nozzle delivers concentrated, uniform heat distribution ideal for soldering and desoldering fine-pitch surface-mount devices on PCBs.

Key Features

• BGA-optimized nozzle design with 22×22mm opening
• Compatible with FR-810 and FR-810B hot air rework stations
• Precision heat concentration for controlled thermal profiles
• Durable construction for extended service life
• Easy installation and removal

Technical Specifications

Applications

Ideal for rework and repair of BGA components, fine-pitch QFP packages, and other surface-mount devices requiring precise thermal control. Suitable for both production and repair environments.