Hot Air Nozzle BGA 24×24mm - Hakko N51-21

Overview

The Hakko N51-21 is a precision hot air nozzle designed specifically for BGA (Ball Grid Array) rework applications. With a 24×24mm opening, this nozzle delivers controlled thermal distribution for reliable solder reflow on BGA packages. Compatible with Hakko FR-810 and FR-810B hot air rework stations.

Key Features

• 24×24mm square opening optimized for BGA components
• Precision-engineered for uniform heat distribution
• Compatible with FR-810 and FR-810B hot air stations
• Durable construction for extended rework sessions
• Enables controlled thermal profiling for sensitive assemblies

Technical Specifications

Applications

Ideal for rework and repair of BGA-packaged components on PCBs. Provides precise thermal control for lead-free and traditional solder reflow processes. Suitable for electronics manufacturing, repair facilities, and prototype development.