MiniTweez Removal Tip SOIC/SOT/TSOP 10 mm for MT-100 - PACE 1124-1007

A 10 mm blade width suits mid-length SOIC and TSOP devices as well as D-Pak power parts. The MT-100 grips the package on both rows, melts the solder and lifts it before the joints freeze again.

Benefits

• Tweezer principle: both arms grip the part from two sides, heat it and lift it in one motion.
• Working width of 10 mm at 0.7 mm thickness, suited to D-Pak, SOT, TSOP and SOIC.
• The MT-100 IntelliHeat handpiece controls the temperature at the tip.

Specifications

Applications

• Removing mid-length SOIC and TSOP packages
• Replacing D-Pak power components
• Repair of control and drive electronics

Compatibility

• MT-100 MiniTweez surface mount rework tweezer, IntelliHeat (6010-0148)
• MT-100 and TP-100 Tip & Tool Stand (6019-0080)