MiniTweez Removal Tip SOIC/SOT/TSOP 8 mm for MT-100 - PACE 1124-1006

Power packages such as the D-Pak have a large solder area that absorbs a lot of heat. The 8 mm wide MiniTweez blades sit flat against the part and reliably free such components as well as SOIC and TSOP packages.

Benefits

• Tweezer principle: both arms grip the part from two sides, heat it and lift it in one motion.
• Working width of 8 mm at 0.7 mm thickness, suited to D-Pak, SOIC, SOT and TSOP.
• The MT-100 IntelliHeat handpiece controls the temperature at the tip.

Specifications

Applications

• Replacing voltage regulators and MOSFETs in D-Pak
• Removing mid-length SOIC devices
• Rework on power supply and motor driver boards

Compatibility

• MT-100 MiniTweez surface mount rework tweezer, IntelliHeat (6010-0148)
• MT-100 and TP-100 Tip & Tool Stand (6019-0080)