BGA Hot Air Nozzle 15.3 x 15.3 mm for BGA 100, for ST 300/325/350 - PACE 4028-5022

Whether prototype or field return, a compact BGA can only be heated through its top surface. The PACE 4028-5022 covers 15.3 x 15.3 mm and focuses the hot air on exactly that area. Its designation assigns it to BGA 100 packages.

Benefits

• 15.3 x 15.3 mm field: the nozzle closely encloses the compact package and the solder balls underneath reflow evenly.
• According to the PACE catalog, alignment templates are included with BGA nozzle assemblies, which helps positioning during placement.
• The spring-loaded vacuum pick in the ST 325 handpiece lifts the part after reflow without reaching for tweezers.

Specifications

Applications

• Removing and installing compact BGA packages of this size
• Gentle part removal ahead of reballing

Compatibility

• PACE ST 300
• PACE ST 325 (8007-0429)
• PACE ST 350