BGA Hot Air Nozzle 14.4 x 14.4 mm, for ST 300/325/350 - PACE 4028-5005

When replacing a small BGA, the heat should go under the package, not into the surroundings. The PACE 4028-5005 covers a 14.4 x 14.4 mm field and keeps the airflow right over the component.

Benefits

• 14.4 x 14.4 mm field: the nozzle closely encloses the compact package and the solder balls underneath reflow evenly.
• According to the PACE catalog, alignment templates are included with BGA nozzle assemblies, which helps positioning during placement.
• The spring-loaded vacuum pick in the ST 325 handpiece lifts the part after reflow without reaching for tweezers.

Specifications

Applications

• Removing and installing compact BGA packages of this size
• Gentle part removal ahead of reballing
• Repair and prototyping with area array components

Compatibility

• PACE ST 300
• PACE ST 325 (8007-0429)
• PACE ST 350