BGA Hot Air Nozzle 26.4 x 26.4 mm, for ST 300/325/350 - PACE 4028-5001

On a BGA the solder joints sit under the package and can only be heated through its body. The PACE 4028-5001 encloses a 26.4 x 26.4 mm field and directs the hot air of the ST station straight over the package.

Benefits

• 26.4 x 26.4 mm field: hot air stays over the package and the solder balls underneath reflow evenly.
• According to the PACE catalog, alignment templates are included with BGA nozzle assemblies, which helps positioning during placement.
• Quick-Fit nozzle: tool-free change on the ST handpiece via the nozzle adapter.
• Combined with the ST 325 time and temperature profiles (up to 20 stored), cycles are repeatable.

Specifications

Applications

• Removing and installing BGA packages of this size
• Gentle component removal ahead of reballing
• Repair and prototyping with area array components

Compatibility

• Tool-free.
• PACE ST 300
• PACE ST 325 (8007-0429)
• PACE ST 350