BGA Hot Air Nozzle 6 x 8 mm for ST 300/325/350 - PACE 4028-5501

The smaller the package, the closer its neighbours usually sit. The PACE 4028-5501 limits the hot air stream to an area of 6 x 8 mm, which makes it suitable for mini BGA and CSP devices that a larger nozzle could hardly heat in a targeted way.

Benefits

• Opening of only 6 x 8 mm: heat stays on the component, nearby capacitors and connectors are spared.
• Rectangular profile for small, elongated packages.
• Listed among the standard BGA nozzles in the PACE catalog for ST 300, ST 325 and ST 350.

Specifications

Applications

• Rework of mini BGA and chip scale packages
• Replacement of small memory and sensor devices on mobile and compact assemblies
• Repair of densely populated boards with tight component spacing

Compatibility

• PACE ST 300
• PACE ST 325
• PACE ST 350