BGA Hot Air Nozzle 13.5 x 15 mm, for ST 300/325/350 - PACE 4028-5007

The PACE 4028-5007 is sized for compact BGA packages at 13.5 x 15 mm. The hot air stays inside the nozzle rim and the solder balls under the part reflow together.

Benefits

• Rectangular 13.5 x 15 mm field: suits elongated BGA packages without spreading the hot air over an oversized square.
• The ST 325 stores up to 20 time and temperature profiles, so every cycle with this nozzle runs the same way.
• According to the PACE catalog, alignment templates are included with BGA nozzle assemblies, which helps positioning during placement.

Specifications

Applications

• Removing and installing compact BGA packages of this size
• Gentle part removal ahead of reballing
• Repair and prototyping with area array components

Compatibility

• PACE ST 300
• PACE ST 325 (8007-0429)
• PACE ST 350