TF2800 BGA and SMD Rework System for PCBs up to 610 mm - PACE 8007-0583

Large server and industrial boards need plenty of bottom-side heat and a holder that keeps them flat. The TF2800 takes PCBs up to 610 x 610 mm, heats them with 1900 W of IR from below and reaches target temperature at the top in seconds with its Inductive-Convection heater, followed by active cooling through the nozzle.

Benefits

• 28 µm placement accuracy from a stepper motor with position encoding, all steps in a single axis.
• 405 x 405 mm bottom heater, can be raised up to 38 mm closer to the board.
• Four thermocouple inputs for profiling and real-time monitoring, two K-type thermocouples included.
• 1080p Vision Overlay System with up to 240x zoom and Quad-Field Imaging.
• Board support beam prevents sagging, auxiliary cooling fan as standard.

Specifications

Applications

• BGA, CGA and QFN rework on large-format PCBs
• Placing parts from 0201 up to 65 mm square
• Thermocouple-based profile development in process engineering