Infrarot-Keramikheizplatte 400W zur Leiterplatten-Vorwärmung - Quick QU854D

Heating an assembly only from above works against the heat sinking of the copper planes and risks lifted pads. The Quick 854D applies a base temperature from below with 400 W of infrared power, adjustable from 50 to 500 °C.

Features

• Contactless infrared ceramic heating, the board rests on a stainless steel grid above the element
• Heated area of about 130 x 130 mm for assemblies up to hand size
• Three memories: two fixed temperatures and one profile with two zones and two times
• Digital LCD readout with calibration function
• Internal type K sensor plus an optional external type K probe placed on the board itself
• Communication interface for integration into a wider process

Technical data

Applications

Preheating before BGA and large SMD removal, rework on multilayer boards with strong heat sinking, repair of power electronics and production benches that repeat a fixed temperature profile.

Scope of delivery

Preheater with stainless steel grid and control panel. An external type K probe is recommended for measuring on the assembly itself.

Compatibility

The unit works independently of the soldering or hot air station in use and combines with a hot air rework station into a bench with top and bottom heat.